Bonding and Backing Plate Services
Release Date£º[2011-5-24 9:33:49]    Total access[2128]Times

Leadmat has developed a unique back-sputtering technique for metallizing targets and backing plates for adhesion layers. Omat extensive background in engineering materials and joining techniques, and experience in stress reduction has allowed it to pioneer several approaches to bonding brittle materials of low to intermediate thermal expansion to high-integrity metallurgical bonds and help customers achieve optimal process performance.

  • Large scale BSM (back-side metallization) capability for sizes up to to 1.8 meters in width and 2 meters in length.
  • Bonding of rotatable (cylindrical) targets in many different material families and configuration. 
  • C-Scan. Ultrasonically test equipment to verify bond integrity. 
  • Precision machining/joining capability for designing and building backing plates from a variety of materials, such as OFHC Copper, Titanium, Stainless Steel, Molybdenum.


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